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Arteris Multi-Die Solution Accelerates AI-Driven Silicon Innovation 2 недели назад


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Arteris Multi-Die Solution Accelerates AI-Driven Silicon Innovation

Advanced semiconductor capabilities are vital for the development of future AI solutions and Arteris’ innovative technology plays a pivotal role. Arteris’ offering reduces chiplet and SoC design time, along with the optimization of power, performance, and area bottlenecks by providing key network-on-chip (NoC) IP technology for standardized die-to-die communication and automating key SoC creation workflows. The expanded multi-die solution from Arteris allows semiconductor firms to compress development cycles, scale modular architectures, and deliver differentiated AI performance—while staying aligned with evolving industry realities. Learn more at arteris.com/multi-die.

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